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Hi- Bond® UNIVERSAL
1.090,00 EGP
Multi purpose universal adhesive 8th generation bonding system containing 10-MDP and MBG (Mesoporous BioGlass) filler
Hi-Bond™ is a MBG(mesoporous BAG) incorporated one-step dental adhesive.
Hi-Bond™ can produce hydroxyapatite by contacting with saliva through BAG.
It has sufficient bonding strength, remineralization effect and preventive effect on post-operative sensitivity
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Description
Multi purpose universal adhesive 8th generation bonding system containing 10-MDP and MBG (Mesoporous BioGlass) filler
Hi-Bond™ is a MBG(mesoporous BAG) incorporated one-step dental adhesive.
Hi-Bond™ can produce hydroxyapatite by contacting with saliva through BAG.
It has sufficient bonding strength, remineralization effect and preventive effect on post-operative sensitivity.
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